P. R. ÇALIN (2020). Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions. *MICROELECTRONICS RELIABILITY*, 110, 113681. https://doi.org/10.1016/j.microrel.2020.113681
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System architect
Tahsin BALCI
Kırıkkale University · IT Department · Programmer
KU Career Ecosystem Software development IT operations
Architect and developer of the KU Career Ecosystem. Designs and builds this system at the IT Department to present staff, publication and unit data under one roof.
