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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

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Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

01 Ocak 2022 Makale Özgün Makale
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PROFESÖR RECEP ÇALIN

Atıf kopyala

P. R. ÇALIN (2022). Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish. *Journal of Materials Science: Materials in Electronics*, 33. https://doi.org/10.1007/s10854-022-07974-8

Yayın bilgileri

Dergi Journal of Materials Science: Materials in Electronics
DOI 10.1007/s10854-022-07974-8
Veri tabanı SCI-Expanded
Cilt / Sayı 33 / -
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Atıf verisi 14 Kasım 2026 tarihinde güncellendi.

Dergi: Journal of Materials Science: Materials in Electronics | Yıl: 2022 | Cilt/Sayı: 33 | DOI: 10.1007/s10854-022-07974-8 | Yazarlar: Dele-Afolabi Temitope, Mohamed Arif Azmah Hanim, Krishna Vidyatharran, Matori Khamirul Amin, Osman Saliza Azlina, ÇALIN RECEP

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