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Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate

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Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate

01 Ocak 2019 Makale Google Scholar

Atıf kopyala

P. R. ÇALIN (2019). Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn–5Sb solder composites on Cu substrate. *Journal of Alloys and Compounds 808, 151714, 2019*.

Yayın bilgileri

Dergi Journal of Alloys and Compounds 808, 151714, 2019
Veri tabanı Google Scholar
Kaynak GoogleScholar

Atıf verisi 13 Kasım 2026 tarihinde güncellendi.

TT Dele-Afolabi, MAA Hanim, OJ Ojo-Kupoluyi, R Calin | Journal of Alloys and Compounds 808, 151714, 2019

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